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Updated: 6 days 5 hours ago

Battery R&D heats up

Wed, 03/18/2009 - 19:29
Despite the steady stream of bad news coming out of the global automotive industry these days, efforts are underway to remake it a more energy efficient, cleaner enterprise.


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Wed, 03/18/2009 - 19:29

Electronic helpers become mandatory for cars, trucks

Wed, 03/18/2009 - 13:36
Besides tire pressure monitors, a number of other safety-related devices will become mandatory over the next few years. Technologies involved include gyros, radar, and pattern recognition.


The votes are in!

Mon, 03/16/2009 - 02:21
Here are the official vehicles of winter.


Logic series designed to resist high temperatures

Fri, 03/13/2009 - 11:14
Despite using a plastic package, a family of standard logic devices can work in environments with temperatures of up to 175 degrees Celsius. With the products, Belgian manufacturer CISSOID aims at automotive and industrial applications.


The Virtual Vehicle: Part 3 - Developing robust wiring harnesses

Fri, 03/13/2009 - 01:53
The proliferation of options within numerous vehicle platforms requires the use of tools that enable data consistency and option handling, as well as complete and efficient wiring verification within the vehicle.


Daimler bus combines hub motors, fuel cells

Thu, 03/12/2009 - 19:47
Automotive OEM Daimler AG (Stuttgart, Germany) has announced a bus which runs on energy produced by fuel cells. At the same time, the concept includes elements of energy recuperation.


Searching for six-degrees-of-separation for energy harvesting and power conversion

Thu, 03/12/2009 - 18:14
Given that most innovations in power management electronics are derived from the pooling of the knowledge or expertise of groups of scientists or engineers then it is likely that the 'six degrees of separation' rule applies to a lot of technology developments.


SMD package for PowerMOSFETs in automotive applications -- developments and trends

Thu, 03/12/2009 - 17:24
Low-voltage PowerMOSFETs have taken over numerous applications in the power train, body or chassis area. Since SMD (surface-mounted device) packages these devices offer several advantages over THD (through hole device) packages, they have become the package of choice in most automotive applications. The article describes NEC's roadmap to further package developments.


Texas Instruments: Floating-point MCUs enable high-end real-time control

Thu, 03/12/2009 - 16:42
Texas Instruments has announced the TMS320C2834x series of Delfino floating-point controllers that double performance to 300 MHz and include 516 KB of single cycle access RAM memory, high resolution pulse width modulation outputs (PWMs), 32-bit QEP modules as well as other control-oriented features.


Energy Harvesting - The next "big thing?"

Wed, 03/11/2009 - 20:03
Energy harvesting in embedded designs is not without its problems and will require designers to analyze very carefully the parameters of their system design to see if these techniques can be used effectively.


MIT advance said to recharge Li-ion batteries in seconds

Wed, 03/11/2009 - 20:00
Massachusetts Institute of Technology (MIT) has invented a surface treatment that fabricates nanoscale grooves atop the traditional lithium iron phosphate material that reduces recharge times to seconds and allows electric cars to accelerate as quickly as gasoline power vehicles.


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Wed, 03/11/2009 - 20:00

Electric car research group formed

Wed, 03/11/2009 - 19:35
Energy storage for electric cars is the focus topic for the Fraunhofer research group established in Oldenburg (Germany). The group will develop prototypes and bring them to market maturity.


Soft-start functionality in LED driver eases eyestrain

Wed, 03/11/2009 - 17:10
This sample circuit includes a dimmable LED driver that leverages a thermal-foldback-protection feature to provide a soft start and mimic the operation of an incandescent bulb.


AMD, Freescale named to Moody's 'Bottom Rung' list

Wed, 03/11/2009 - 13:36
Several technology companies, including Advanced Micro Devices Inc. and Freescale Semiconductor Inc. have been named to credit rating agency Moody's list of corporate bond issuers likely to default on their loan obligations.


Simulink integrated with Messina

Tue, 03/10/2009 - 19:52
Automotive test system expert Berner & Matther GmbH and software vendor The Mathworks are collaborating on the development of integrated platforms aiming at developing and testing automotive ECU software.


Tire pressure monitoring reduces CO2 emissons

Tue, 03/10/2009 - 18:58
The European Parliament Tuesday (March 10) passed a proposal that will make tire pressure sensors for new cars mandatory. The industry is prepared to offer the technology required — but new developments enhance the scope of options.


Lean inventories could speed recovery

Tue, 03/10/2009 - 02:01
The semiconductor industry will suffer double-digit contraction in 2009, but lean inventories across the supply chain could jump-start a rapid recovery for the industry once the economy starts to improve, an analyst said.


Mean-time-between-failure made easy

Sat, 03/07/2009 - 07:15
An almost "no-sweat" guide to adding MTBF software to your design. Whether the system you're designing is open-source or proprietary, here is a virtually no-cost software-based method to track Time-in-Service and MTBF, using resources that already exist in most embedded devices.